XCV600E-8FG676C
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 676-BBGA, FCBGA |
| Number of Pins | 676 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 1999 |
| Series | Virtex®-E |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.71V~1.89V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XCV600E |
| Pin Count | 676 |
| Number of Outputs | 444 |
| Operating Supply Voltage | 1.8V |
| Number of I/O | 444 |
| RAM Size | 36kB |
| Clock Frequency | 416MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 15552 |
| Total RAM Bits | 294912 |
| Number of Gates | 985882 |
| Number of LABs/CLBs | 3456 |
| Speed Grade | 8 |
| Combinatorial Delay of a CLB-Max | 0.4 ns |
| Height Seated (Max) | 2.6mm |
| Length | 27mm |
| Width | 27mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XCV600E-8FG676C Overview
In the package 676-BBGA, FCBGA, this product is provided. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. A total of 444 I/Os allow data to be transferred in a more coherent manner. Logic blocks consist of 15552 logic elements/cells. In order for the device to operate, a supply voltage of 1.8V volts needs to be provided. There is a Field Programmable Gate Arrays family component in this FPGA part. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~1.89V. The Virtex?-E Series is one of the types of FPGAs that belong to this type. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. With this device, you will be able to make use of 444 outputs. It is for space saving reasons that this FPGA model is contained in Tray. In total, it has a total of 676 terminations. As far as the RAM bits are concerned, this device offers you a total of 294912. Parts related to this part can be found using its base part number XCV600E. During the configuration of this FPGA module, the RAM si36kBe reaches 36kB to ensure that the program runs normally. 676 pins are designed into the device. 3456 LABs and CLBs are built into this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. When operating with the supply voltage of 1.8V, designers can fully make use of its flexibility. Fpga semiconductor is made up of 985882 gates as fpga semiconductors basic building block. Fpga semiconductor is equipped wfpga semiconductorh 676 pin count. Usually, fpga semiconductor uses a 416MHz crystal.
XCV600E-8FG676C Features
444 I/Os
Up to 294912 RAM bits
676 LABs/CLBs
XCV600E-8FG676C Applications
There are a lot of Xilinx Inc. XCV600E-8FG676C FPGAs applications.
- Digital signal processing
- Camera time adjustments
- Secure Communication
- Electronic Warfare
- Medical imaging
- Consumer Electronics
- High Performance Computing
- Automotive driver's assistance
- Data Mining
- Telecommunication
