XCV812E-6FG900C
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 900-BBGA |
| Number of Pins | 900 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2002 |
| Series | Virtex®-E EM |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 900 |
| ECCN Code | 3A991.D |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.71V~1.89V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XCV812E |
| Pin Count | 900 |
| Number of Outputs | 556 |
| Operating Supply Voltage | 1.8V |
| Number of I/O | 556 |
| RAM Size | 140kB |
| Clock Frequency | 357MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 21168 |
| Total RAM Bits | 1146880 |
| Number of Gates | 254016 |
| Number of LABs/CLBs | 4704 |
| Speed Grade | 6 |
| Combinatorial Delay of a CLB-Max | 0.47 ns |
| Length | 31mm |
| Width | 31mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
XCV812E-6FG900C Overview
Fpga chips is supplied in the 900-BBGA package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The device has 556 I/O ports for more coherent data transfer. There are 21168 logic elements/cells to form a fundamental building block. It is powered from a supply voltage of 1.8V. The Field Programmable Gate Arrays family of FPGAs includes this part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. The Virtex?-E EM Series is one of the types of FPGAs that belong to this type. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 556 outputs incorporated in this device. In order to save space, this FPGA model has been contained in Tray. As a whole, it has 900 terminations. The RAM bits that this device offer is 1146880. In order to find related parts, use the part number XCV812E as a base. It is crucial that the RAM si140kBe of this FPGA module reaches 140kB so that the program can run normally. The device has 900 pins which are included in the design. The FPGA consists of 4704 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. With a 1.8V supply voltage, designers can fully utilize the flexibility of the device. There are 254016 gates in its basic building block. A total of 900 pins are included in this device. A crystal oscillating at 357MHz is one of the most common components of this device.
XCV812E-6FG900C Features
556 I/Os
Up to 1146880 RAM bits
900 LABs/CLBs
XCV812E-6FG900C Applications
There are a lot of Xilinx Inc. XCV812E-6FG900C FPGAs applications.
- Wired Communications
- Military DSP
- Medical Electronics
- Wireless Communications
- Medical ultrasounds
- Video & Image Processing
- Digital signal processing
- Device controllers
- Ecosystem
- Automotive advanced driver assistance systems (ADAS)
