XCZU11EG-1FFVB1517E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 1517-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 488 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
There are Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processors in this SoC.The manufacturer assigns this system on a chip with a 1517-BBGA, FCBGA package as per the manufacturer's specifications.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.A MCU, FPGA technique is used for the SoC design's internal architecture.A system on chip SoC of this type belongs to the Zynq? UltraScale+? MPSoC EG series.The average operating temps for this SoC meaning should be 0°C~100°C TJ.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 653K+ Logic Cells.An advanced Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 488.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU11EG-1FFVB1517E System On Chip (SoC) applications.
- Mobile computing
- Vending machines
- Automotive
- Functional safety for critical applications in the automotive
- ARM processors
- Vending machines
- Optical drive
- Functional safety for critical applications in the aerospace
- Smartphones
- System-on-chip (SoC)
