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XCZU11EG-1FFVC1156I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU11EG-1FFVC1156I
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 303
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O(Kg)

Details

Tags

Parameters
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 360
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
RoHS Status ROHS3 Compliant
Factory Lead Time 1 Week
Package / Case 1156-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC has been developed.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package as per the manufacturer's specifications.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq? UltraScale+? MPSoC EG is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 653K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 360 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU11EG-1FFVC1156I System On Chip (SoC) applications.

  • Temperature Sensors
  • Sensor network-on-chip (sNoC)
  • Microprocessors
  • CNC control
  • Microcontroller based SoC ( RISC-V, ARM)
  • Servo drive control module
  • Samsung galaxy gear
  • ARM Cortex M4 microcontroller
  • AC drive control module
  • Automotive

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