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XCZU11EG-3FFVC1760E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU11EG-3FFVC1760E
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 999
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O(Kg)

Details

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Parameters
Factory Lead Time 1 Week
Package / Case 1760-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 512
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.This system on a chip is packaged as 1760-BBGA, FCBGA by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 653K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 512 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

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XCZU11EG-3FFVC1760E System On Chip (SoC) applications.

  • Wireless networking
  • Functional safety for critical applications in the aerospace
  • sequence controllers
  • Automated sorting equipment
  • Industrial sectors
  • Defense
  • Body control module
  • Transmitters
  • POS Terminals
  • Measurement tools

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