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XCZU11EG-3FFVF1517E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 464 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU11EG-3FFVF1517E
  • Package: 1517-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 387
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 464 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 1517-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 464
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Its package is 1517-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq?UltraScale+? FPGA, 653K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 464.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

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XCZU11EG-3FFVF1517E System On Chip (SoC) applications.

  • Communication network-on-Chip (cNoC)
  • Central inverter
  • Wireless networking
  • Medical
  • USB hard disk enclosure
  • Special Issue Information
  • Microprocessors
  • Industrial AC-DC
  • Medical
  • Print Special Issue Flyer

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