Parameters |
Factory Lead Time |
1 Week |
Package / Case |
900-BBGA, FCBGA |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
HTS Code |
8542.31.00.01 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
204 |
Speed |
500MHz, 600MHz, 1.2GHz |
RAM Size |
256KB |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series number of this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 747K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 204 inputs and outputs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU15EG-1FFVC900E System On Chip (SoC) applications.
- Industrial AC-DC
- Samsung galaxy gear
- Industrial automation devices
- Servo drive control module
- Multiprocessor system-on-chips (MPSoCs)
- PC peripherals
- Video Imaging
- Functional safety for critical applications in the aerospace
- ARM processors
- String inverter