XCZU17EG-1FFVD1760I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O

Manufacturer: Xilinx Inc.
Nocochips NO: 903-XCZU17EG-1FFVD1760I
Package: 1760-BBGA, FCBGA
Datasheet: PDF
Stock: 313
Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O(Kg)

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Parameters
Factory Lead Time	1 Week
Package / Case	1760-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	308
Speed	500MHz, 600MHz, 1.2GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.Its package is 1760-BBGA, FCBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the Zynq? UltraScale+? MPSoC EG series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.Tray package houses this SoC system on a chip.This SoC part contains a total of 308 I/Os in total.