XCZU17EG-L1FFVB1517I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 1517-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B1517 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 644 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.Its package is 1517-BBGA, FCBGA.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC EG series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.An advanced Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 644 I/Os.Use a power supply with a voltage of 0.72V if possible.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.This SoC system on a chip can run on a power supply that is at least 0.698V.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.Furthermore, this SoC processor also incorporates additional features similar to ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY which are available on other SoC processors also.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU17EG-L1FFVB1517I System On Chip (SoC) applications.
- Industrial transport
- PC peripherals
- Video Imaging
- DC-input BLDC motor drive
- Mobile market
- Communication interfaces ( I2C, SPI )
- Level
- Smart appliances
- Medical Pressure
- Measurement testers
