XCZU17EG-L2FFVC1760E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 1760-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B1760 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 512 |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.This system on a chip is packaged as 1760-BBGA, FCBGA by the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.The internal architecture of this SoC design is based on the MCU, FPGA technique.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.This SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells, an important feature to keep in mind.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part contains a total of 512 I/Os in total.A 0.72V power supply should be used.It is unsafe to operate the SoCs wireless at voltages above 0.742V.Power supply should be at least 0.698V.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.Moreover, this SoC processor is also equipped with additional features of ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU17EG-L2FFVC1760E System On Chip (SoC) applications.
- Sensor network-on-chip (sNoC)
- CNC control
- Smartphone accessories
- Wireless sensor networks
- Industrial transport
- Industrial automation devices
- Central alarm system
- Deep learning hardware
- Level
- Microprocessors
