Parameters |
Factory Lead Time |
1 Week |
Package / Case |
1924-BBGA, FCBGA |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
HTS Code |
8542.31.00.01 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
668 |
Speed |
500MHz, 600MHz, 1.2GHz |
RAM Size |
256KB |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.Assigned with the package 1924-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design is based on the MCU, FPGA technique.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells.Tray package houses this SoC system on a chip.This SoC part has a total of 668 I/Os.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU19EG-1FFVE1924E System On Chip (SoC) applications.
- Samsung galaxy gear
- String inverter
- POS Terminals
- POS Terminals
- Mobile market
- Test and Measurement
- Functional safety for critical applications in the aerospace
- Special Issue Information
- Embedded systems
- Video Imaging