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XCZU19EG-2FFVC1760E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU19EG-2FFVC1760E
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 870
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 1760-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 512
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 1143K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 512 I/Os in total.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU19EG-2FFVC1760E System On Chip (SoC) applications.

  • Special Issue Editors
  • Measurement testers
  • Smart appliances
  • Apple smart watch
  • Smartphone accessories
  • Robotics
  • POS Terminals
  • Industrial sectors
  • Communication network-on-Chip (cNoC)
  • ARM

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