XCZU19EG-L1FFVE1924I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 1924-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B1924 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 668 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Package 1924-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the Zynq? UltraScale+? MPSoC EG series of system on a chips.The average operating temps for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells, an important feature to keep in mind.This SoC system on a chip has been designed in a state-of-the-art Tray package.668 I/Os in total are included in this SoC part.A 0.72V power supply should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.As a minimum, the power supply of the SoC system on a chip needs to be 0.698V.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.Moreover, this SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY as its additional features.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU19EG-L1FFVE1924I System On Chip (SoC) applications.
- Mobile computing
- Flow Sensors
- Central alarm system
- String inverter
- Special Issue Editors
- Apple smart watch
- Robotics
- Keyboard
- Industrial Pressure
- Keywords
