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XCZU2CG-2SBVA484I

484 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 82 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU2CG-2SBVA484I
  • Package: 484-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 990
  • Description: 484 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 82 I/O0.85V (Kg)

Details

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Parameters
Factory Lead Time 1 Week
Package / Case 484-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 484
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B484
Supply Voltage-Max (Vsup) 0.876V
Number of I/O 82
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC has been developed.Assigned with the package 484-BFBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC CG series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells is important.Housed in the state-of-art Tray package.This SoC part has a total of 82 I/Os.It is recommended to use a 0.85V power supply.For the SoCs wireless, a voltage higher than 0.876V is considered unsafe.In total, there are 484 terminations, which makes system on a chip possible.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

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XCZU2CG-2SBVA484I System On Chip (SoC) applications.

  • Digital Media
  • Industrial transport
  • Wireless networking
  • Industrial
  • Automated sorting equipment
  • Smartphones
  • Deep learning hardware
  • Smartphone accessories
  • Cyberphysical system-on-chip
  • Central alarm system

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