Parameters |
Factory Lead Time |
1 Week |
Package / Case |
625-BFBGA, FCBGA |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC CG |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.31.00.01 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
180 |
Speed |
533MHz, 1.3GHz |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) are used in the construction of this SoC.There is a 625-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.In the Zynq? UltraScale+? MPSoC CG series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.This SoC part contains a total of 180 I/Os in total.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU2CG-2SFVA625E System On Chip (SoC) applications.
- Optical drive
- Sensor network-on-chip (sNoC)
- Central alarm system
- Temperature Sensors
- Healthcare
- Communication interfaces ( I2C, SPI )
- AC-input BLDC motor drive
- Functional safety for critical applications in the aerospace
- High-end PLC
- Video Imaging