banner_page

XCZU2CG-2SFVA625E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU2CG-2SFVA625E
  • Package: 625-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 107
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 625-BFBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 180
Speed 533MHz, 1.3GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) are used in the construction of this SoC.There is a 625-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.In the Zynq? UltraScale+? MPSoC CG series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.This SoC part contains a total of 180 I/Os in total.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU2CG-2SFVA625E System On Chip (SoC) applications.

  • Optical drive
  • Sensor network-on-chip (sNoC)
  • Central alarm system
  • Temperature Sensors
  • Healthcare
  • Communication interfaces ( I2C, SPI )
  • AC-input BLDC motor drive
  • Functional safety for critical applications in the aerospace
  • High-end PLC
  • Video Imaging

Write a review

Note: HTML is not translated!
    Bad           Good