XCZU2EG-3SFVA625E
| Parameters | |
|---|---|
| Package / Case | 625-BFBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2013 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 625 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 0.9V |
| Reach Compliance Code | compliant |
| JESD-30 Code | S-PBGA-B625 |
| Number of I/O | 180 |
| Speed | 600MHz, 667MHz, 1.5GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.The manufacturer assigns this system on a chip with a 625-BFBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 180 inputs and outputs.Use a power supply with a voltage of 0.9V if possible.As a result, there are 625 terminations in total, which does really benefit system on a chip.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU2EG-3SFVA625E System On Chip (SoC) applications.
- Smartphone accessories
- Industrial Pressure
- Self-aware system-on-chip (SoC)
- Video Imaging
- Apple smart watch
- Avionics
- CNC control
- PC peripherals
- POS Terminals
- Deep learning hardware
