XCZU3CG-1SFVC784E
| Parameters | |
|---|---|
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 252 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Package / Case | 784-BFBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Bulk |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor.It has been assigned a package 784-BFBGA, FCBGA by its manufacturer for this system on a chip.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.The Zynq? UltraScale+? MPSoC CG series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells and that is something to note.It is packaged in a state-of-the-art Bulk package.252 I/Os are available in this SoC part.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3CG-1SFVC784E System On Chip (SoC) applications.
- ARM
- Central alarm system
- Level
- AC-input BLDC motor drive
- Apple smart watch
- Mouse
- Communication network-on-Chip (cNoC)
- Communication interfaces ( I2C, SPI )
- Smart appliances
- External USB hard disk/SSD
