XCZU3CG-2SFVA625E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 625-BFBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Bulk |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 180 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).This system on a chip is packaged as 625-BFBGA, FCBGA by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC CG series.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells is important.A state-of-the-art Bulk package houses this SoC system on a chip.180 I/Os in total are included in this SoC part.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
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