XCZU3CG-L1SBVA484I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 484-BFBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 484 |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B484 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 82 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 484-BFBGA, FCBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.In the Zynq? UltraScale+? MPSoC CG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A key point to note is that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part has a total of 82 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 0.72V.The SoCs wireless cannot operate at a voltage greater than 0.742V because it is considered unsafe for the application.In order to run it, it must be fed by at least 0.698V of power.Having 484 terminations in total makes system on a chip possible.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Moreover, this SoC processor is also equipped with additional features of ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU3CG-L1SBVA484I System On Chip (SoC) applications.
- Microcontroller based SoC ( RISC-V, ARM)
- Embedded systems
- Cyberphysical system-on-chip
- Optical drive
- Remote control
- Temperature
- Industrial Pressure
- Flow Sensors
- Measurement testers
- Keywords
