banner_page

XCZU3EG-1SFVA625I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 180 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU3EG-1SFVA625I
  • Package: 625-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 369
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 180 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 625-BFBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 180
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


On this SoC, there is Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor.Package 625-BFBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.The average operating temps for this SoC meaning should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.Housed in the state-of-art Tray package.As a whole, this SoC part includes 180 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU3EG-1SFVA625I System On Chip (SoC) applications.

  • Body control module
  • Samsung galaxy gear
  • Communication interfaces ( I2C, SPI )
  • System-on-chip (SoC)
  • Mobile computing
  • ARM processors
  • Medical
  • Embedded systems
  • Healthcare
  • Central alarm system

Write a review

Note: HTML is not translated!
    Bad           Good