XCZU3EG-2SBVA484E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 484-BFBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 82 |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 484-BFBGA, FCBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.It comes in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 82 inputs and outputs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3EG-2SBVA484E System On Chip (SoC) applications.
- Measurement tools
- USB hard disk enclosure
- RISC-V
- Industrial sectors
- Print Special Issue Flyer
- ARM processors
- Mobile market
- Temperature Sensors
- DC-input BLDC motor drive
- Medical Pressure
