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XCZU3EG-2SBVA484I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 82 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU3EG-2SBVA484I
  • Package: 484-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 845
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 82 I/O(Kg)

Details

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Parameters
Factory Lead Time 1 Week
Package / Case 484-BFBGA, FCBGA
Supplier Device Package 484-FCBGA (19x19)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of I/O 82
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


On this SoC, there is Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor.It has been assigned a package 484-BFBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides reliable operation.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the Zynq? UltraScale+? MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.In total, this SoC part has 82 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

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XCZU3EG-2SBVA484I System On Chip (SoC) applications.

  • Digital Media
  • High-end PLC
  • Cyber security for critical applications in the aerospace
  • Measurement tools
  • Efficient hardware for training of neural networks
  • Central inverter
  • Wireless sensor networks
  • Industrial transport
  • Special Issue Information
  • Networked sensors

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