XCZU3EG-2SFVC784I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 784-BFBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 784 |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.85V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B784 |
| Supply Voltage-Max (Vsup) | 0.876V |
| Supply Voltage-Min (Vsup) | 0.825V |
| Number of I/O | 252 |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC has been developed.Assigned with the package 784-BFBGA, FCBGA, this system on a chip comes from the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells, an important feature to keep in mind.Housed in the state-of-art Tray package.252 I/Os are available in this SoC part.A 0.85V power supply is recommended.In the SoCs wireless, voltages above 0.876V are considered unsafe.As long as it receives a power supply that is at least 0.825V, it should be able to function.It is really beneficial to have system on a chip since there are 784 terminations in total.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU3EG-2SFVC784I System On Chip (SoC) applications.
- Remote control
- AC drive control module
- ARM support modules
- Body control module
- Networked sensors
- Industrial sectors
- Multiprocessor system-on-chips (MPSoCs)
- Self-aware system-on-chip (SoC)
- Industrial AC-DC
- Sensor network-on-chip (sNoC)
