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XCZU3EG-3SFVC784E

784 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O0.9V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU3EG-3SFVC784E
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 605
  • Description: 784 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O0.9V (Kg)

Details

Tags

Parameters
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Number of I/O 252
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status Non-RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


On this SoC, there is Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor.Assigned with the package 784-BFBGA, FCBGA, this system on a chip comes from the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 252 I/Os in total.For safe operation, it is advisable to utilize a power supply with 0.9V voltage.As a result, there are 784 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

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XCZU3EG-3SFVC784E System On Chip (SoC) applications.

  • Temperature Sensors
  • Microcontroller
  • Smart appliances
  • Self-aware system-on-chip (SoC)
  • Networked sensors
  • Automotive
  • ARM support modules
  • Communication network-on-Chip (cNoC)
  • ARM processors
  • Cyber security for critical applications in the aerospace

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