Parameters |
Package / Case |
784-BFBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
784 |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
0.9V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B784 |
Number of I/O |
252 |
Speed |
600MHz, 667MHz, 1.5GHz |
RAM Size |
256KB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
On this SoC, there is Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor.Assigned with the package 784-BFBGA, FCBGA, this system on a chip comes from the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 252 I/Os in total.For safe operation, it is advisable to utilize a power supply with 0.9V voltage.As a result, there are 784 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU3EG-3SFVC784E System On Chip (SoC) applications.
- Temperature Sensors
- Microcontroller
- Smart appliances
- Self-aware system-on-chip (SoC)
- Networked sensors
- Automotive
- ARM support modules
- Communication network-on-Chip (cNoC)
- ARM processors
- Cyber security for critical applications in the aerospace