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XCZU4CG-1FBVB900I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU4CG-1FBVB900I
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 697
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 900-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 500MHz, 1.2GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) is built into this SoC.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.A system on chip SoC of this type belongs to the Zynq? UltraScale+? MPSoC CG series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 204 I/Os.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

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XCZU4CG-1FBVB900I System On Chip (SoC) applications.

  • Keywords
  • Industrial sectors
  • sequence controllers
  • Functional safety for critical applications in the aerospace
  • Central alarm system
  • Fitness
  • Digital Signal Processing
  • External USB hard disk/SSD
  • Sports
  • Vending machines

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