XCZU4CG-2FBVB900E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 204 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.A MCU, FPGA technique is used for the SoC design's internal architecture.A system on chip SoC of this type belongs to the Zynq? UltraScale+? MPSoC CG series.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.In total, this SoC part has 204 I/Os.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4CG-2FBVB900E System On Chip (SoC) applications.
- Functional safety for critical applications in the automotive
- ARM processors
- Functional safety for critical applications in the aerospace
- Flow Sensors
- Video Imaging
- Mobile computing
- String inverter
- Robotics
- Smartphones
- Microcontroller
