XCZU4CG-L1FBVB900I
| Parameters | |
|---|---|
| JESD-30 Code | R-PBGA-B900 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 204 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC is built.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq? UltraScale+? MPSoC CG is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 192K+ Logic Cells.Housed in the state-of-art Tray package.This SoC part has a total of 204 I/Os.For safe operation, it is advisable to utilize a power supply with 0.72V voltage.For the SoCs wireless, a voltage higher than 0.742V is considered unsafe.At least 0.698V can be supplied as a power source.system on a chip benefits from 900 terminations.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU4CG-L1FBVB900I System On Chip (SoC) applications.
- Remote control
- Networked sensors
- Digital Media
- Communication interfaces ( I2C, SPI )
- Self-aware system-on-chip (SoC)
- Three phase UPS
- Central alarm system
- Microcontroller based SoC ( RISC-V, ARM)
- Temperature Sensors
- ARM support modules
