XCZU4CG-L2FBVB900E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B900 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 204 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is used to build this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The Zynq? UltraScale+? MPSoC CG series contains this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells together.Housed in the state-of-art Tray package.This SoC part has a total of 204 I/Os.Use a power supply with a voltage of 0.72V if possible.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.There is a possibility that it can be powered by a power supply of at least 0.698V.In total, there are 900 terminations, which makes system on a chip possible.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU4CG-L2FBVB900E System On Chip (SoC) applications.
- sequence controllers
- Medical
- Video Imaging
- PC peripherals
- POS Terminals
- System-on-chip (SoC)
- Multiprocessor system-on-chips (MPSoCs)
- Apple smart watch
- Automotive gateway
- Industrial AC-DC
