XCZU4EG-2SFVC784I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 784-BFBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 252 |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Assigned with the package 784-BFBGA, FCBGA, this system on a chip comes from the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells together.A state-of-the-art Tray package houses this SoC system on a chip.In total, this SoC part has 252 I/Os.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EG-2SFVC784I System On Chip (SoC) applications.
- Body control module
- Apple smart watch
- Transmitters
- Deep learning hardware
- Test and Measurement
- Central alarm system
- Automotive gateway
- Microprocessors
- Smart appliances
- Vending machines
