Parameters |
Factory Lead Time |
1 Week |
Package / Case |
900-BBGA, FCBGA |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC CG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
HTS Code |
8542.31.00.01 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
204 |
Speed |
500MHz, 1.2GHz |
RAM Size |
256KB |
Core Processor |
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is integrated into this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the Zynq? UltraScale+? MPSoC CG series of system on a chips.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells, an important feature to keep in mind.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part has a total of 204 I/Os.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5CG-1FBVB900I System On Chip (SoC) applications.
- Keywords
- Digital Signal Processing
- Remote control
- Avionics
- Industrial sectors
- PC peripherals
- Industrial robot
- Digital Media
- RISC-V
- Flow Sensors