XCZU5CG-2FBVB900I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.85V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B900 |
| Supply Voltage-Max (Vsup) | 0.876V |
| Supply Voltage-Min (Vsup) | 0.825V |
| Number of I/O | 204 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC is built.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC CG series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 204 I/Os.A 0.85V power supply is recommended.An excessive voltage of 0.876V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.In order to run it, it must be fed by at least 0.825V of power.In total, there are 900 terminations, which is great for system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU5CG-2FBVB900I System On Chip (SoC) applications.
- Mobile market
- CNC control
- Temperature
- Automated sorting equipment
- Special Issue Editors
- Sports
- Digital Signal Processing
- Industrial AC-DC
- Digital Media
- ARM processors
