Parameters |
Factory Lead Time |
1 Week |
Package / Case |
784-BFBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC CG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
784 |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
0.85V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B784 |
Number of I/O |
252 |
Speed |
533MHz, 1.3GHz |
RAM Size |
256KB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 784-BFBGA, FCBGA by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Zynq? UltraScale+? MPSoC CG is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells is important.This SoC system on a chip has been designed in a state-of-the-art Tray package.252 I/Os in total are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.85V.In total, there are 784 terminations, which makes system on a chip possible.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU5CG-2SFVC784I System On Chip (SoC) applications.
- Central alarm system
- Automotive gateway
- POS Terminals
- Wireless sensor networks
- Robotics
- Transmitters
- Healthcare
- Networked Media Encode/Decode
- High-end PLC
- Robotics