XCZU5CG-L1FBVB900I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B900 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 204 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.Manufacturer assigns package 900-BBGA, FCBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq? UltraScale+? MPSoC CG is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells and that is something to note.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.204 I/Os are included in this SoC part.A 0.72V power supply is recommended.An excessive voltage of 0.742V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.There is a possibility that it can be powered by a power supply of at least 0.698V.In total, there are 900 terminations, so system on a chip is really aided by this.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Furthermore, this SoC processor also incorporates additional features similar to ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY which are available on other SoC processors also.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU5CG-L1FBVB900I System On Chip (SoC) applications.
- Wireless networking
- Sensor network-on-chip (sNoC)
- Vending machines
- String inverter
- Keyboard
- CNC control
- Flow Sensors
- DC-input BLDC motor drive
- Defense
- PC peripherals
