Parameters |
Factory Lead Time |
1 Week |
Package / Case |
784-BFBGA, FCBGA |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2016 |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
HTS Code |
8542.31.00.01 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
252 |
Speed |
500MHz, 600MHz, 1.2GHz |
RAM Size |
256KB |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.Package 784-BFBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells and that is something to note.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part has a total of 252 I/Os.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EG-1SFVC784E System On Chip (SoC) applications.
- Industrial sectors
- Efficient hardware for training of neural networks
- Temperature
- Wireless networking
- Automotive gateway
- Industrial Pressure
- High-end PLC
- Digital Media
- ARM
- Special Issue Editors