XCZU5EV-L1FBVB900I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC EV |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B900 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 204 |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.The Zynq? UltraScale+? MPSoC EV series contains this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part contains a total of 204 I/Os in total.It is recommended to use a 0.72V power supply.The SoCs wireless cannot operate at a voltage greater than 0.742V because it is considered unsafe for the application.This SoC system on a chip can run on a power supply that is at least 0.698V.In total, there are 900 terminations, which makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU5EV-L1FBVB900I System On Chip (SoC) applications.
- Temperature Sensors
- Smart appliances
- Transmitters
- Robotics
- Apple smart watch
- Microcontroller
- Measurement testers
- POS Terminals
- Measurement tools
- Multiprocessor system-on-chips (MPSoCs)
