XCZU6CG-2FFVB1156E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 1156-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Bulk |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 328 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.Assigned with the package 1156-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC CG series.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells.Featured in the state-of-the-art Bulk package, this SoC system on a chip provides outstanding performance.328 I/Os in total are included in this SoC part.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU6CG-2FFVB1156E System On Chip (SoC) applications.
- External USB hard disk/SSD
- Robotics
- Healthcare
- Smart appliances
- Automated sorting equipment
- Mobile market
- Wireless sensor networks
- Apple smart watch
- ARM
- Industrial robot
