Parameters |
Package / Case |
1156-BBGA, FCBGA |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
HTS Code |
8542.31.00.01 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
328 |
Speed |
533MHz, 600MHz, 1.3GHz |
RAM Size |
256KB |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package as per the manufacturer's specifications.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells, an important feature to keep in mind.It comes in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 328 inputs and outputs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU6EG-2FFVB1156I System On Chip (SoC) applications.
- Vending machines
- Transmitters
- Efficient hardware for training of neural networks
- Medical
- Automated sorting equipment
- Body control module
- Smartphone accessories
- System-on-chip (SoC)
- Industrial Pressure
- Central alarm system