XCZU7CG-L2FBVB900E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 900-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 900 |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 0.72V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B900 |
| Supply Voltage-Max (Vsup) | 0.742V |
| Supply Voltage-Min (Vsup) | 0.698V |
| Number of I/O | 204 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) are used in the construction of this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq? UltraScale+? MPSoC CG is the series in which this system on chip SoC falls under.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.204 I/Os are included in this SoC part.It is recommended to use a 0.72V power supply.In the SoCs wireless, high voltages above 0.742V are considered dangerous and should not be used.Power supplies of at least 0.698V are required.Having 900 terminations in total makes system on a chip possible.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU7CG-L2FBVB900E System On Chip (SoC) applications.
- Digital Signal Processing
- Sensor network-on-chip (sNoC)
- High-end PLC
- Automated sorting equipment
- Industrial automation devices
- Special Issue Editors
- Efficient hardware for training of neural networks
- Embedded systems
- Apple smart watch
- Healthcare
