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XCZU7EG-1FFVC1156I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU7EG-1FFVC1156I
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 587
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 1156-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 360
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.Its package is 1156-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides reliable operation.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the Zynq? UltraScale+? MPSoC EG series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells together.Housed in the state-of-art Tray package.360 I/Os in total are included in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU7EG-1FFVC1156I System On Chip (SoC) applications.

  • Industrial
  • Three phase UPS
  • Mobile computing
  • Keyboard
  • Central inverter
  • Cyber security for critical applications in the aerospace
  • Central alarm system
  • Microcontroller based SoC ( RISC-V, ARM)
  • Networked sensors
  • String inverter

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