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XCZU9EG-3FFVB1156E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 328 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU9EG-3FFVB1156E
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 302
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 328 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 1156-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2013
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 328
Speed 600MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 1156-BBGA, FCBGA by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 599K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.328 I/Os are available in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

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XCZU9EG-3FFVB1156E System On Chip (SoC) applications.

  • Industrial automation devices
  • External USB hard disk/SSD
  • Flow Sensors
  • Central alarm system
  • ARM support modules
  • Medical
  • Optical drive
  • Robotics
  • Avionics
  • Communication interfaces ( I2C, SPI )

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