Parameters |
Factory Lead Time |
1 Week |
Package / Case |
1156-BBGA, FCBGA |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2013 |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
HTS Code |
8542.31.00.01 |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Number of I/O |
328 |
Speed |
600MHz, 1.5GHz |
RAM Size |
256KB |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 1156-BBGA, FCBGA by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 599K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.328 I/Os are available in this SoC part.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU9EG-3FFVB1156E System On Chip (SoC) applications.
- Industrial automation devices
- External USB hard disk/SSD
- Flow Sensors
- Central alarm system
- ARM support modules
- Medical
- Optical drive
- Robotics
- Avionics
- Communication interfaces ( I2C, SPI )