Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Adhesive |
Package / Case | Ceramic |
Material | Ceramic |
Shape | Square |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Series | XL-25 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Type | Heat Spreader |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height Off Base (Height of Fin) | 0.085 2.15mm |
Length | 0.787 20.00mm |
Width | 0.787 20.00mm |
RoHS Status | RoHS Compliant |