Parameters |
Package / Case |
256-BBGA |
Supplier Device Package |
256-PBGA (23x23) |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
1999 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC823 |
Speed |
66MHz |
Core Processor |
PowerPC |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
I2C, SMC, SCC, SPI, UART |
Co-Processors/DSP |
Communications; RISC CPM |
Display & Interface Controllers |
LCD, Video |
RoHS Status |
Non-RoHS Compliant |
XPC823CZT66B2T Overview
The embedded microprocessor has been packed in 256-BBGA for convenient overseas shipping. In order to provide high reliability, advanced packaging method Tray is used. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. K-40°C~95°C TAw what the operating temperature is around -40°C~95°C TA. A MPC8xx series item. Core-wise, this CPU has a PowerPC processor. There are DRAM RAM controllers on this CPU. To serve better this microprocessor features I2C, SMC, SCC, SPI, UART interfaces. 3.3V is the I/O speed of this CPU. If you are looking for variants of the cpu microprocessor, try search with PC823. A supplier offers a 256-PBGA (23x23) package.
XPC823CZT66B2T Features
PowerPC Core
XPC823CZT66B2T Applications
There are a lot of NXP USA Inc. XPC823CZT66B2T Microprocessor applications.
- Mobile computers
- Ipad
- Embedded gateways
- Home appliances
- Network communication, mobile communication field
- Ipod
- Laminators
- Hearing aids
- Communication-bluetooth, Wi-Fi, radio
- Fax machines