XPC8255CVVIFBC
| Parameters | |
|---|---|
| Package / Case | 480-LBGA Exposed Pad |
| Supplier Device Package | 480-TBGA (37.5x37.5) |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Published | 2002 |
| Series | MPC82xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | PC8255 |
| Speed | 200MHz |
| Core Processor | PowerPC G2 |
| Voltage - I/O | 3.3V |
| Ethernet | 10/100Mbps (3) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM, SDRAM |
| Additional Interfaces | I2C, SCC, SMC, SPI, UART, USART |
| Co-Processors/DSP | Communications; RISC CPM |
| RoHS Status | ROHS3 Compliant |
XPC8255CVVIFBC Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 480-LBGA Exposed Pad. High reliability is achieved using advanced packaging method Tray. There are 1 Core 32-Bit cores per bus width on the CPU. K-40°C~105°C TAw what the operating temperature is around -40°C~105°C TA. In the series MPC82xx, it is found. The CPU is powered by a PowerPC G2 core. There are DRAM, SDRAM RAM controllers on this CPU. The microprocessor features interfaces I2C, SCC, SMC, SPI, UART, USART for better service. In this CPU, I/O is set to 3.3V. To find variants of the microprocessor, try searching with PC8255. It is offered by suppliers as a package 480-TBGA (37.5x37.5).
XPC8255CVVIFBC Features
PowerPC G2 Core
XPC8255CVVIFBC Applications
There are a lot of NXP USA Inc. XPC8255CVVIFBC Microprocessor applications.
- Smart instruments
- Calculator
- Smartphones-calling, video calling, texting, email
- Refrigerators
- Oscilloscopes
- Communication-bluetooth, Wi-Fi, radio
- Fire alarms
- Industrial robot
- Process control devices
- Oil and gas
