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XPC850CZT50BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850CZT50BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 240
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature -40°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850CZT50BU Overview


The microprocessor is conveniently packaged in 256-BGA, making it easy to ship internationally. High reliability can be achieved by using the advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Identify the operating temperature around -40°C~95°C TA. This is a member of the MPC8xx series. It has DRAM RAM controllers. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces. As far as I/O is concerned, this CPU runs at 3.3V. To find variants of the microprocessor, try searching with PC850.

XPC850CZT50BU Features



XPC850CZT50BU Applications


There are a lot of NXP USA Inc. XPC850CZT50BU Microprocessor applications.

  • Fax machines
  • Hand-held metering systems
  • Dryers
  • Binding machines
  • Walkie talkies
  • Office automation equipment and computer peripherals
  • Smart highways (navigation, traffic control, information monitoring and car service)
  • DDC control
  • Ipod
  • 3D printers

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