XPC850CZT66BU
| Parameters | |
|---|---|
| Package / Case | 256-BGA |
| Operating Temperature | -40°C~95°C TA |
| Packaging | Tray |
| Published | 2004 |
| Series | MPC8xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | PC850 |
| Speed | 66MHz |
| Voltage - I/O | 3.3V |
| Ethernet | 10Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM |
| USB | USB 1.x (1) |
| Additional Interfaces | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
| Co-Processors/DSP | Communications; CPM |
| RoHS Status | Non-RoHS Compliant |
XPC850CZT66BU Overview
The embedded microprocessor has been packed in 256-BGA for convenient overseas shipping. High reliability is achieved using advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Obtain a basic understanding of operating temperature around 0°C. This is part of the MPC8xx series. DRAM RAM controllers are used by this CPU. With its HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces, this microprocessor will be able to serve you better. 3.3V is the CPU's I/O address. The microprocessor can be searched for with PC850 if you are looking for variants.
XPC850CZT66BU Features
XPC850CZT66BU Applications
There are a lot of NXP USA Inc. XPC850CZT66BU Microprocessor applications.
- Equipment control
- Traditional industrial transformation
- Temperature sensing and controlling devices
- Automobile
- Home video and audio
- Microwave ovens
- Projector
- Auto-breaking system
- Instrumentation and process control field
- Electronic jamming systems
