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XPC850DECVR50BU

Microprocessor MPC8xx Series PC850 256-BBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850DECVR50BU
  • Package: 256-BBGA
  • Datasheet: PDF
  • Stock: 455
  • Description: Microprocessor MPC8xx Series PC850 256-BBGA (Kg)

Details

Tags

Parameters
Package / Case 256-BBGA
Operating Temperature -40°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status ROHS3 Compliant

XPC850DECVR50BU Overview


Since the microprocessor is packed in 256-BBGA, shipping overseas is convenient. In order to provide high reliability, advanced packaging method Tray is used. 1 Core 32-Bit cores/Bus width are present in the CPU. It is important to understand the operating temperature around -40°C~95°C TA. A MPC8xx series item. Memory controllers for this CPU are DRAM. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART for better service. I/O is run at 3.3V on this CPU. Try searching for variants of the cpu microprocessor with PC850.

XPC850DECVR50BU Features



XPC850DECVR50BU Applications


There are a lot of NXP USA Inc. XPC850DECVR50BU Microprocessor applications.

  • Christmas lights
  • Aerospace navigation systems
  • Instrumentation and process control field
  • PDAs, game consoles
  • Ipod
  • Washing machine
  • Telephone sets
  • Nintendo
  • Agriculture, transportation field
  • Smoke alarms

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