Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
XPC850DECVR50BU Overview
Since the microprocessor is packed in 256-BBGA, shipping overseas is convenient. In order to provide high reliability, advanced packaging method Tray is used. 1 Core 32-Bit cores/Bus width are present in the CPU. It is important to understand the operating temperature around -40°C~95°C TA. A MPC8xx series item. Memory controllers for this CPU are DRAM. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART for better service. I/O is run at 3.3V on this CPU. Try searching for variants of the cpu microprocessor with PC850.
XPC850DECVR50BU Features
XPC850DECVR50BU Applications
There are a lot of NXP USA Inc. XPC850DECVR50BU Microprocessor applications.
- Christmas lights
- Aerospace navigation systems
- Instrumentation and process control field
- PDAs, game consoles
- Ipod
- Washing machine
- Telephone sets
- Nintendo
- Agriculture, transportation field
- Smoke alarms