Parameters |
Package / Case |
256-BGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
XPC850DECVR66BU Overview
With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. K-40°C~95°C TAw what the operating temperature is around -40°C~95°C TA. From the MPC8xx series. A total of DRAM RAM controllers are used by this CPU. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. The CPU runs at 3.3V when it comes to I/O. You can search for variants of a microprocessor with PC850.
XPC850DECVR66BU Features
XPC850DECVR66BU Applications
There are a lot of NXP USA Inc. XPC850DECVR66BU Microprocessor applications.
- Refrigerators
- Robots
- PDAs, game consoles
- Medical instruments
- Hearing aids
- Telephone sets
- Consumer electronics products
- Teletext terminals
- Digital set-top boxes
- Auto-breaking system