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XPC850DECVR66BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850DECVR66BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 467
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature -40°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status ROHS3 Compliant

XPC850DECVR66BU Overview


With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. K-40°C~95°C TAw what the operating temperature is around -40°C~95°C TA. From the MPC8xx series. A total of DRAM RAM controllers are used by this CPU. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. The CPU runs at 3.3V when it comes to I/O. You can search for variants of a microprocessor with PC850.

XPC850DECVR66BU Features



XPC850DECVR66BU Applications


There are a lot of NXP USA Inc. XPC850DECVR66BU Microprocessor applications.

  • Refrigerators
  • Robots
  • PDAs, game consoles
  • Medical instruments
  • Hearing aids
  • Telephone sets
  • Consumer electronics products
  • Teletext terminals
  • Digital set-top boxes
  • Auto-breaking system

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