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XPC850DECZT50BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850DECZT50BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 494
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature -40°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850DECZT50BU Overview


Packed in 256-BGA, the microprocessor is convenient for shipping overseas. High reliability can be achieved by using the advanced packaging method Tray. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Recognize operating temperatures around -40°C~95°C TA. It comes from the MPC8xx series. There are DRAM RAM controllers used by this CPU. Microprocessors with HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces are designed to serve users better. 3.3V is the CPU's I/O address. Using PC850 will help you find variants of the cpu microprocessor.

XPC850DECZT50BU Features



XPC850DECZT50BU Applications


There are a lot of NXP USA Inc. XPC850DECZT50BU Microprocessor applications.

  • Ipad
  • Tape drives
  • Embedded gateways
  • Microwave ovens
  • Robots
  • Entertainment-radios, CD players, televisions
  • Projectors
  • Instrument control
  • Oscilloscopes
  • Auto-breaking system

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