Parameters |
Package / Case |
256-BGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850DECZT50BU Overview
Packed in 256-BGA, the microprocessor is convenient for shipping overseas. High reliability can be achieved by using the advanced packaging method Tray. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Recognize operating temperatures around -40°C~95°C TA. It comes from the MPC8xx series. There are DRAM RAM controllers used by this CPU. Microprocessors with HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces are designed to serve users better. 3.3V is the CPU's I/O address. Using PC850 will help you find variants of the cpu microprocessor.
XPC850DECZT50BU Features
XPC850DECZT50BU Applications
There are a lot of NXP USA Inc. XPC850DECZT50BU Microprocessor applications.
- Ipad
- Tape drives
- Embedded gateways
- Microwave ovens
- Robots
- Entertainment-radios, CD players, televisions
- Projectors
- Instrument control
- Oscilloscopes
- Auto-breaking system