Parameters |
Package / Case |
256-BGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850DECZT66BU Overview
Packed in 256-BGA, the microprocessor is convenient for shipping overseas. High reliability is achieved using advanced packaging method Tray. Cores/Bus width is 1 Core 32-Bit. It is important to understand the operating temperature around -40°C~95°C TA. This is part of the MPC8xx series. The CPU contains DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. 3.3V is the CPU's I/O address. If you are looking for variants of the cpu microprocessor, try search with PC850.
XPC850DECZT66BU Features
XPC850DECZT66BU Applications
There are a lot of NXP USA Inc. XPC850DECZT66BU Microprocessor applications.
- Playstation
- Industrial control field
- Glucose monitoring systems (for Type 1 Diabetes)
- Accu-check
- Pacemakers (used to control abnormal heart rhythm)
- Information appliances (networking of household appliances)
- Instrument control
- Entertainment-radios, CD players, televisions
- Instrumentation and process control field
- Electromechanical control