Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tape & Reel (TR) |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
XPC850DEVR50BUR2 Overview
The embedded microprocessor has been packed in 256-BBGA for convenient overseas shipping. High reliability is achieved with advanced packaging method Tape & Reel (TR). In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. The operating temperature around 0°C~95°C TA should be understood. This is part of the MPC8xx series. It has DRAM RAM controllers. This microprocessor has HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to serve you better. The CPU runs at 3.3V when it comes to I/O. To find variants of the microprocessor, try searching with PC850.
XPC850DEVR50BUR2 Features
XPC850DEVR50BUR2 Applications
There are a lot of NXP USA Inc. XPC850DEVR50BUR2 Microprocessor applications.
- Digital cameras
- Blood pressure monitors
- Removable disks
- Laminators
- Washing machine
- Automatic control
- Volt meter
- Home video and audio
- Fire alarms
- Communication-bluetooth, Wi-Fi, radio